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학술지 A Single-Chamber System of Initiated Chemical Vapor Deposition and Atomic Layer Deposition for Fabrication of Organic/Inorganic Multilayer Films
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저자
김봉준, 박홍근, 성혜정, 이민석, 권병화, 김도형, 이영일, 이현구, 이정익, 임성갑
발행일
201706
출처
Advanced Engineering Materials, v.19 no.6, pp.1-9
ISSN
1438-1656
출판사
John Wiley & Sons
DOI
https://dx.doi.org/10.1002/adem.201600819
협약과제
16MB1100, 미래광고 서비스를 위한 에너지절감형 환경적응 I/O (Input/Output) 플랫폼 기술 개발, 황치선
초록
A single-chamber system capable of depositing both organic and inorganic layers by initiated chemical vapor deposition (iCVD) and atomic layer deposition (ALD) is demonstrated to facilitate the fabrication of organic/inorganic hybrid thin film encapsulation (TFE). The chamber geometry and the process conditions of iCVD and ALD are similar to each other, which enabled the design of the single-chamber system. Both organic and inorganic films deposited via the single-chamber system produces films with their properties equivalent to those deposited in separate iCVD and ALD reactors. Alternating the deposition mode between iCVD and ALD produces organic/inorganic multilayers with outstanding barrier properties as well as optical transparency mechanical flexibility.
KSP 제안 키워드
Atomic Layer Deposition, Deposition mode, Initiated Chemical Vapor Deposition, Inorganic films, Mechanical flexibility, Optical transparency, Organic-inorganic hybrid, Organic/inorganic multilayer, Process conditions, Single-chamber, Thin film encapsulation