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Journal Article Silicone‐Based Adhesives with Highly Tunable Adhesion Force for Skin‐Contact Applications
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Authors
Bong Kuk Lee, Jin Hwa Ryu, In-Bok Baek, Yarkyeon Kim, Won Ick Jang, Sang-Hyeob Kim, Yong Sun Yoon, Seung Hwan Kim, Seong-Gu Hong, Sangwon Byun, Han Young Yu
Issue Date
2017-11
Citation
Advanced Healthcare Materials, v.6, no.22, pp.1-8
ISSN
2192-2640
Publisher
WILEY-VCH Verlag GmbH & Co. KGaA
Language
English
Type
Journal Article
DOI
https://dx.doi.org/10.1002/adhm.201700621
Abstract
A fundamental approach to fabricating silicone-based adhesives with highly tunable adhesion force for the skin-contact applications is presented. Liquid blends consisting of vinyl-multifunctional polydimethylsiloxane (V-PDMS), hydride-terminated PDMS (H-PDMS), and a tackifier composed of a silanol-terminated PDMS/MQ resin mixture and the MQ resin are used as the adhesive materials. The peel adhesion force of addition-cured adhesives on the skin is increased by increasing the H-PDMS molecular weights and the tackifier content, and decreasing the H-PDMS/V-PDMS ratio. There is an inverse relationship between the adhesion force and the Young's modulus. The low-modulus adhesives with a low H-PDMS/V-PDMS ratio exhibit enhanced adhesion properties. The low-modulus adhesives with the high MQ resin content show significantly enhanced adhesion properties. These adhesives exhibit a wide range of modulus (2??499 kPa), and their adhesion force (0.04??5.38 N) is superior to commercially available soft silicone adhesives (0.82??2.79 N). The strong adhesives (>≈2 N) provide sufficient adhesion for fixing the flexible electrocardiogram (ECG) device to the skin in most daily activity. The human ECG signals are successfully recorded in real time. These results suggest that the silicone-based adhesives should be useful as an atraumatic adhesive for the skin-contact applications.
KSP Keywords
Adhesion force, Adhesive materials, Daily activities, ECG signals, Enhanced adhesion, Peel adhesion, Real-time, Resin content, Tunable adhesion, Young's Modulus, adhesion properties