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Conference Paper
Development of Stacking Process for 3D TSV (Through Silicon Via) Structure using Laser
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- Issue Date
- 2017-12
- Citation
- International Microelectronics Assembly and Packaging Society (IMAPS) 2017, pp.1-5
- Language
- English
- Type
- Conference Paper
- Abstract
- TSV chips were designed and fabricated to investigate the effects of the types of the stacking process on the manufacturability. Two processes were compared: thermocompression and laser bonding. The pitch of UBMs, solder bumps, and TSVs were 50μm. A fluxing underfill was developed and used as a pre-applied underfill during the stacking process. The bonding profiles and the solder joint morphology based on the thermocompression and the laser bonding were compared.
- KSP Keywords
- 3D TSV, Joint morphology, Laser bonding, Solder bump, Solder joint, Through silicon vias(TSV)