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학술지 Conductive Adhesive with Transient Liquid-phase Sintering Technology for High-power Device Applications
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저자
엄용성, 장건수, 손지혜, 배현철, 최광성
발행일
201912
출처
ETRI Journal, v.41 no.6, pp.820-828
ISSN
1225-6463
출판사
한국전자통신연구원 (ETRI)
DOI
https://dx.doi.org/10.4218/etrij.2018-0250
협약과제
19PB1700, 유연 LED 모듈용 레이저 기반 청정 접합소재 및 공정 기술 개발, 엄용성
초록
A highly reliable conductive adhesive obtained by transient liquid-phase sintering (TLPS) technologies is studied for use in high-power device packaging. TLPS involves the low-temperature reaction of a low-melting metal or alloy with a high-melting metal or alloy to form a reacted metal matrix. For a TLPS material (consisting of Ag-coated Cu, a Sn96.5-Ag3.0-Cu0.5 solder, and a volatile fluxing resin) used herein, the melting temperature of the metal matrix exceeds the bonding temperature. After bonding of the TLPS material, a unique melting peak of TLPS is observed at 356혻°C, consistent with the transient behavior of Ag3Sn혻+혻Cu6Sn5혻?넂혻liquid혻+혻Cu3Sn reported by the National Institute of Standards and Technology. The TLPS material shows superior thermal conductivity as compared with other commercially available Ag pastes under the same specimen preparation conditions. In conclusion, the TLPS material can be a promising candidate for a highly reliable conductive adhesive in power device packaging because remelting of the SAC305 solder, which is widely used in conventional power modules, is not observed.
키워드
conductive adhesive, device packaging, high reliability, power module, transient liquid-phase sintering
KSP 제안 키워드
Ag-coated Cu, Bonding temperature, Device packaging, High Reliability, High power, Low melting, Low temperature(LT), Low-temperature reaction, Melting temperature(Tm), Metal matrix, National Institute of Standards and Technology
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