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학술지 Optical Subassembly Modules Using Light Sources Butt-Coupled With Silica-Based PLC
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저자
윤석준, 한영탁, 김석태, 신장욱, 박상호, 이동훈, 이서영, 백용순
발행일
202001
출처
IEEE Photonics Technology Letters, v.32 no.2, pp.132-135
ISSN
1041-1135
출판사
IEEE
DOI
https://dx.doi.org/10.1109/LPT.2019.2961398
협약과제
19HB2100, 데이터센터 통신용량 증대를 위한 저전력 On-Board 집적 400Gbps 광송수신 엔진 기술, 백용순
초록
We have fabricated DML/EML-based subassembly modules based on chip-to-chip optical butt-coupling with straight waveguides between a silica AWG chip and commercial directly modulated laser (DML) or electro-absorption modulated laser (EML) chips. By properly inducing external optical feedback on the DML chips, we experimentally demonstrate that 3-dB bandwidths of the DML-based subassembly module can be increased by 5 9.5 GHz compared with those of commercial 28-Gbaud DML chips. The EML-based subassembly module exhibits optical characteristics insensitive to the external optical reflection with a side mode suppression ratio (SMSR) of over 50 dB, revealing excellent optical eye patterns under 112-Gbps PAM4 operations.
키워드
Light sources, optical butt-coupling, PAM4, silica-based PLC
KSP 제안 키워드
9.5 GHZ, Coupled with, Coupling with, Directly modulated laser(DML), Electro-absorption, Light sources, Optical characteristics, Silica-based, butt-coupling, chip-to-chip, eye patterns