ETRI-Knowledge Sharing Plaform

ENGLISH

성과물

논문 검색
구분 SCI
연도 ~ 키워드

상세정보

학술지 Application of Thermal Initiator for Characteristic Improvements of Polymeric Replica Mold for UV Nanoimprint Lithography
Cited 1 time in scopus Download 0 time Share share facebook twitter linkedin kakaostory
저자
정예슬, 박재훈, 이봉국, 류진화, 백규하, 도이미
발행일
201412
출처
Journal of Nanoscience and Nanotechnology, v.14 no.8, pp.5932-5936
ISSN
1533-4880
출판사
American Scientific Publishers (ASP)
DOI
https://dx.doi.org/10.1166/jnn.2014.8800
협약과제
13VC5400, 150ºC이하 인쇄기반 플렉세블 디스플에이 백플레인용 산화물 반도체, 절연체 잉크소재 및 공정 기술 개발, 도이미
초록
We report the improvement of the hardness and modulus properties in a silsesquioxane-based soft replica mold by adding thermal initiator, without deteriorating the UV transmittance at the wavelength of 365 nm. It is found that thermal initiator used for this work contributes to improving the hardness and modulus values up to 0.175 and 3.585 GPa, while the UV transmittance value is still above 75%. The optimized soft replica mold built on a flexible plastic substrate allows submicron-scale patterns to be transferred onto a rigid Si substrate by means of UV-NIL process. Consequently, we demonstrate that the developed soft replica mold can be a suitable replacement for typical hard molds, promising further use in mold-based nanolithography for the fabrication of high-resolution nanopatterns over large areas. Copyright © 2014 American Scientific Publishers.
키워드
Nanoimprint lithography, Soft mold, Stiffness, Thermal initiator
KSP 제안 키워드
65 nm, Hardness and modulus, High-resolution, Plastic substrate, Si substrate, Thermal initiator, UV nanoimprint lithography, UV transmittance, UV-NIL, modulus properties, replica mold