ETRI-Knowledge Sharing Plaform

KOREAN
논문 검색
Type SCI
Year ~ Keyword

Detail

Journal Article Characterization of Fluxing and Hybrid Underfills with Micro-encapsulated Catalyst for Long Pot Life
Cited 35 time in scopus Download 2 time Share share facebook twitter linkedin kakaostory
Authors
Yong-Sung Eom, Ji-Hye Son, Keon-Soo Jang, Hak-Sun Lee, Hyun-Cheol Bae, Kwang-Seong Choi, Heung-Soap Choi
Issue Date
2014-06
Citation
ETRI Journal, v.36, no.3, pp.343-351
ISSN
1225-6463
Publisher
한국전자통신연구원 (ETRI)
Language
English
Type
Journal Article
DOI
https://dx.doi.org/10.4218/etrij.14.0113.0570
Abstract
For the fine-pitch application of flip-chip bonding with semiconductor packaging, fluxing and hybrid underfills were developed. A micro-encapsulated catalyst was adopted to control the chemical reaction at room and processing temperatures. From the experiments with a differential scanning calorimetry and viscometer, the chemical reaction and viscosity changes were quantitatively characterized, and the optimum type and amount of micro-encapsulated catalyst were determined to obtain the best pot life from a commercial viewpoint. It is expected that fluxing and hybrid underfills will be applied to fine-pitch flip-chip bonding processes and be highly reliable. © 2014 ETRI.
KSP Keywords
Bonding process, Differential scanning calorimetry(photo-DSC), Encapsulated catalyst, Fine pitch, Flip-chip bonding, Scanning calorimetry(DSC), Semiconductor packaging, chemical reaction(Biomimetic), highly reliable, pot life