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Journal Article
Characterization of Fluxing and Hybrid Underfills with Micro-encapsulated Catalyst for Long Pot Life
- Authors
- Yong-Sung Eom, Ji-Hye Son, Keon-Soo Jang, Hak-Sun Lee, Hyun-Cheol Bae, Kwang-Seong Choi, Heung-Soap Choi
- Issue Date
- 2014-06
- Citation
- ETRI Journal, v.36, no.3, pp.343-351
- ISSN
- 1225-6463
- Publisher
- 한국전자통신연구원 (ETRI)
- Language
- English
- Type
- Journal Article
- Abstract
- For the fine-pitch application of flip-chip bonding with semiconductor packaging, fluxing and hybrid underfills were developed. A micro-encapsulated catalyst was adopted to control the chemical reaction at room and processing temperatures. From the experiments with a differential scanning calorimetry and viscometer, the chemical reaction and viscosity changes were quantitatively characterized, and the optimum type and amount of micro-encapsulated catalyst were determined to obtain the best pot life from a commercial viewpoint. It is expected that fluxing and hybrid underfills will be applied to fine-pitch flip-chip bonding processes and be highly reliable. © 2014 ETRI.
- KSP Keywords
- Bonding process, Differential scanning calorimetry(photo-DSC), Encapsulated catalyst, Flip-chip(FC), Flip-chip bonding, Scanning calorimetry(DSC), Semiconductor packaging, chemical reaction(Biomimetic), fine pitch, highly reliable, pot life