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학술지 Characterization of Fluxing and Hybrid Underfills with Micro-encapsulated Catalyst for Long Pot Life
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저자
엄용성, 손지혜, 장건수, 이학선, 배현철, 최광성, 최흥섭
발행일
201406
출처
ETRI Journal, v.36 no.3, pp.343-351
ISSN
1225-6463
출판사
한국전자통신연구원 (ETRI)
DOI
https://dx.doi.org/10.4218/etrij.14.0113.0570
초록
For the fine-pitch application of flip-chip bonding with semiconductor packaging, fluxing and hybrid underfills were developed. A micro-encapsulated catalyst was adopted to control the chemical reaction at room and processing temperatures. From the experiments with a differential scanning calorimetry and viscometer, the chemical reaction and viscosity changes were quantitatively characterized, and the optimum type and amount of micro-encapsulated catalyst were determined to obtain the best pot life from a commercial viewpoint. It is expected that fluxing and hybrid underfills will be applied to fine-pitch flip-chip bonding processes and be highly reliable. © 2014 ETRI.
KSP 제안 키워드
Bonding process, Differential scanning calorimetry(photo-DSC), Encapsulated catalyst, Fine pitch, Flip-chip bonding, Scanning calorimetry(DSC), Semiconductor packaging, chemical reaction(Biomimetic), highly reliable, pot life