상세정보
학술지
Characterization of Fluxing and Hybrid Underfills with Micro-encapsulated Catalyst for Long Pot Life
- 발행일
- 201406
- 출처
- ETRI Journal, v.36 no.3, pp.343-351
- ISSN
- 1225-6463
- 출판사
- 한국전자통신연구원 (ETRI)
- 초록
- For the fine-pitch application of flip-chip bonding with semiconductor packaging, fluxing and hybrid underfills were developed. A micro-encapsulated catalyst was adopted to control the chemical reaction at room and processing temperatures. From the experiments with a differential scanning calorimetry and viscometer, the chemical reaction and viscosity changes were quantitatively characterized, and the optimum type and amount of micro-encapsulated catalyst were determined to obtain the best pot life from a commercial viewpoint. It is expected that fluxing and hybrid underfills will be applied to fine-pitch flip-chip bonding processes and be highly reliable. © 2014 ETRI.
- KSP 제안 키워드
- Bonding process, Differential scanning calorimetry(photo-DSC), Encapsulated catalyst, Fine pitch, Flip-chip bonding, Scanning calorimetry(DSC), Semiconductor packaging, chemical reaction(Biomimetic), highly reliable, pot life