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A Novel Superjunction Trench Double-Diffused MOSFETs Fabrication Process by Using High Aspect-ratio Trench Etching and Boron Lateral Diffusion Processes
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- 저자
- 발행일
- 201207
- 출처
- International Conference on Microeletronics and Plasma Technology (ICMAP) 2012, pp.405-405
- 협약과제
- 12MB2100, BLDC 모터용 고전압/대전류 파워모듈 및 ESD 기술개발, 양일석
- KSP 제안 키워드
- Diffusion process, High aspect ratio, Lateral diffusion, Trench etching, fabrication process