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Conference Paper
Fine-Pitch, Low-Volume SoP(Solder-on-Pad) Process
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- Authors
- Ho-Eun Bae, Kwang-Seong Choi, Hyun-Cheol Bae, Yong-Sung Eom, Dong-sik Bae
- Issue Date
- 2012-12
- Citation
- Electronics Packaging Technology Conference (EPTC) 2012, pp.723-727
- Publisher
- IEEE
- Language
- English
- Type
- Conference Paper
- Abstract
- Low-volume, low-cost and lead-free Solder-on-Pad (SoP) process using solder bump maker (SBM) is proposed for the fine-pitch flip-chip bonding process. The SBM is composed of a lead-free solder powder and a resin. The resin in the SBM consists of a polymer matrix, a deoxidizing agent and additives. The deoxidizing agent and additives remove the oxide layer on the surface of the solder powder. The bumping process features no-mask process so that a fine pitch bump array can be easily achievable. It mainly consists of two thermal steps; one is for the aggregation of the solder powder on the metal pads on a substrate and the other for the reflow process to make the round solder bump array. The thermo-rheological behavior of the SBM was characterized using a differential scanning calorimetry (DSC) and a dynamic mechanical analyzer (DMA). With this material and process, the solder bump array was successfully formed with pitch of 130μm. © 2012 IEEE.
- KSP Keywords
- Bonding process, Differential scanning calorimetry(photo-DSC), Differential scanning calorimetry (dsc), Dynamic mechanical analyzer, Fine pitch bump, Flip-chip bonding, Lead-free solder powder, Low-cost, Oxide layer, Reflow process, Rheological Behavior