상세정보
학술지
Stretchable Copper Interconnects with Three-Dimensional Coiled Structures
- 발행일
- 201312
- 출처
- Journal of Micromechanics and Microengineering, v.23 no.12, pp.1-7
- ISSN
- 0960-1317
- 출판사
- Institute of Physics (IOP)
- 협약과제
- 13VB1900, 에너지 절감을 위한 7인치기준 2W급 환경적응 디스플레이 신모드 핵심 원천 기술 개발, 추혜용
- 초록
- We propose a new scheme of stretchable metal interconnects utilizing the electroplated three-dimensional (3D) coil structure, as a strategy for improving the stretching performance of spring-like electrodes through the suppression of local stress concentration. In this process, the 3D copper coils are fabricated by a multi-step electroplating process, and embedded within an elastomeric substrate forming stretchable configuration. By comparing the stretching behavior of the two-dimensional and 3D coils under static or cyclic deformation, the beneficial effects of the 3D configuration have been demonstrated. The present technique can be regarded as an effective way to enhance the stability of interconnects under cyclic deformation significantly, while maintaining the high mechanical strength and electrical conductivity of electroplated electrodes. © 2013 IOP Publishing Ltd.
- KSP 제안 키워드
- Coiled structures, Copper interconnects, Electrical conductivity(EC), Electroplating process, Local stress, Metal interconnects, Multi-step, Spring-like, Stress Concentration, Three dimensional(3D), cyclic deformation