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Stretchable Copper Interconnects with Three-Dimensional Coiled Structures
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- Authors
- Chan Woo Park, Soon Won Jung, Sang Chul Lim, Ji-Young Oh, Bock Soon Na, Sang Seok Lee, Hye Yong Chu, Jae Bon Koo
- Issue Date
- 2013-12
- Citation
- Journal of Micromechanics and Microengineering, v.23, no.12, pp.1-7
- ISSN
- 0960-1317
- Publisher
- Institute of Physics (IOP)
- Language
- English
- Type
- Journal Article
- Abstract
- We propose a new scheme of stretchable metal interconnects utilizing the electroplated three-dimensional (3D) coil structure, as a strategy for improving the stretching performance of spring-like electrodes through the suppression of local stress concentration. In this process, the 3D copper coils are fabricated by a multi-step electroplating process, and embedded within an elastomeric substrate forming stretchable configuration. By comparing the stretching behavior of the two-dimensional and 3D coils under static or cyclic deformation, the beneficial effects of the 3D configuration have been demonstrated. The present technique can be regarded as an effective way to enhance the stability of interconnects under cyclic deformation significantly, while maintaining the high mechanical strength and electrical conductivity of electroplated electrodes. © 2013 IOP Publishing Ltd.
- KSP Keywords
- Coiled structures, Copper interconnects, Electrical Conductivity, Electroplating process, High mechanical strength, Local stress, Metal interconnects, Multi-step, Spring-like, Stress Concentration, Three dimensional(3D)