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Conference Paper
Hybrid-Integrated Coherent Receiver Using Chip-to-Chip Bonding Technology
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- Authors
- Jong-Hoi Kim, Joong-Seon Choe, Kwang-Seong Choi, Chun-Ju Youn, Duk-Jun Kim, Yong-Hwan Kwon, Eun-Soo Nam
- Issue Date
- 2012-11
- Citation
- Asia Communications and Photonics Conference (ACP) 2012, pp.1-4
- Publisher
- IEEE
- Language
- English
- Type
- Conference Paper
- Abstract
- We present a hybrid-integrated coherent receiver module using a chip-to-chip bonding technology to integrate a spot-size converter integrated photodiode array chip and an optical hybrid chip using a silica-based PLC technology.
- KSP Keywords
- Bonding technology, Coherent receiver, Optical hybrid, Photodiode array, Plc technology, Receiver module, Silica-based, Spot size converter(SSC), array chip, chip bonding, chip-to-chip