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Conference Paper
Improvement of Mechanical Properties in Replica Mold Using Thermal Initiator
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- Authors
- Y. S. Jeong, J. H. Park, B. K. Lee, J. H. Ryu, K.-S. Park, Z.-S. Kim, D.-P. Kim, K.-H. Baek, L.-M. Do
- Issue Date
- 2012-05
- Citation
- International Conference on Molecular Electronics and Devices (ME&D) 2012, pp.1-1
- Language
- English
- Type
- Conference Paper
- KSP Keywords
- Mechanical properties(PMCs), Replica mold, Thermal initiator