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Conference Paper
Novel Low-Volume Solder-on-Pad (SoP) Material and Process for Flip Chip Bonding Using Au Stud Bumps
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- Issue Date
- 2012-05
- Citation
- Electronic Components and Technology Conference (ECTC) 2012, pp.1919-1924
- Publisher
- IEEE
- Language
- English
- Type
- Conference Paper
- Abstract
- A novel solder bumping material and process for low-volume solder-on-pad (SoP) have been developed to be applied in the flip chip bonding using Au stud bumps. It features a maskless, low-cost, and lead-free material. The thicknesses of the solder bumps on pads on a substrate were measured about 10 μm. With this material and optimized process, as well as, fluxing underfill, a 3D IC module composed of a GPU, two SRAM, two Si interposer with TSVs, and passives were successfully developed. © 2012 IEEE.
- KSP Keywords
- 3D-IC, Flip-chip(FC), Flip-chip bonding, Lead-free material, Low-cost, Optimized process, Si interposer, Solder bumping, low-volume