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Conference Paper Novel Solder-on-Pad (SoP) Material and Process for Low-Cost Interposers

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Authors: Kwang-Seong Choi, Ho-Eun Bae, Hyun-Cheol Bae, Yong-Sung Eom

Issue Date: 2012-11

Citation: Annual Global Interposer Technology Workshop (GIT) 2012, pp.1-2

Language: English

Type: Conference Paper

KSP Keywords: Low-cost

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