상세정보
학술지
Novel Bumping Process for Solder on Pad Technology
- 발행일
- 201304
- 출처
- ETRI Journal, v.35 no.2, pp.340-343
- ISSN
- 1225-6463
- 출판사
- 한국전자통신연구원 (ETRI)
- 협약과제
- 12MB1600, 웨이퍼레벨 3차원 IC 설계 및 집적기술, 최광성
- 초록
- A novel bumping process using solder bump maker is developed for the maskless low-volume solder on pad (SoP) technology of fine-pitch flip chip bonding. The process includes two main steps: one is the aggregation of powdered solder on the metal pads on a substrate via an increase in temperature, and the other is the reflow of the deposited powder to form a low-volume SoP. Since the surface tension that exists when the solder is below its melting point is the major driving force of the solder deposit, only a small quantity of powdered solder adjacent to the pads can join the aggregation process to obtain a uniform, low-volume SoP array on the substrate, regardless of the pad configurations. Through this process, an SoP array on an organic substrate with a pitch of 130 μm is successfully formed. © 2013 ETRI.
- KSP 제안 키워드
- Aggregation process, Driving forces, Fine pitch, Flip-chip bonding, Organic Substrate, Solder On Pad, Solder bump, Surface tension(ST), low-volume, melting point