BROWSE
Detail
Journal Article
Novel Bumping Process for Solder on Pad Technology
- Authors
- Kwang-Seong Choi, Ho-Eun Bae, Hyun-Cheol Bae, Yong-Sung Eom
- Issue Date
- 2013-04
- Citation
- ETRI Journal, v.35, no.2, pp.340-343
- ISSN
- 1225-6463
- Publisher
- 한국전자통신연구원 (ETRI)
- Language
- English
- Type
- Journal Article
- Abstract
- A novel bumping process using solder bump maker is developed for the maskless low-volume solder on pad (SoP) technology of fine-pitch flip chip bonding. The process includes two main steps: one is the aggregation of powdered solder on the metal pads on a substrate via an increase in temperature, and the other is the reflow of the deposited powder to form a low-volume SoP. Since the surface tension that exists when the solder is below its melting point is the major driving force of the solder deposit, only a small quantity of powdered solder adjacent to the pads can join the aggregation process to obtain a uniform, low-volume SoP array on the substrate, regardless of the pad configurations. Through this process, an SoP array on an organic substrate with a pitch of 130 μm is successfully formed. © 2013 ETRI.
- KSP Keywords
- Aggregation process, Driving forces, Flip-chip(FC), Flip-chip bonding, Organic substrate, Solder On Pad, Solder bump, Surface tension(ST), fine pitch, low-volume, melting point