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Conference Paper Epoxy Copper Paste as an Isotropic Conductive Adhesive
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Authors
Yong-Sung EOM, Hyun-Cheol Bae, Kwang-Seong CHOI
Issue Date
2013-04
Citation
International Conference on Electronics Packaging (ICEP) 2013, pp.507-510
Language
English
Type
Conference Paper
KSP Keywords
Isotropic conductive adhesive, copper paste
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