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Conference Paper
A Bottom-Inlet type MEMS Acoustic Sensor with Wheel-Shaped Back-Plate Anchor
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- Authors
- Jaewoo Lee, C. H. Je, W. S. Yang, Jongdae Kim
- Issue Date
- 2013-07
- Citation
- EUROCON 2013, pp.2116-2122
- Language
- English
- Type
- Conference Paper
- Abstract
- A bottom-inlet type micro-electro-mechanical system (MEMS) acoustic sensor with a wheel-shaped back-plate anchor is presented. Underneath the back-plate, the wheel-shape anchor is newly inserted to be adjusted to a fixed stator on a substrate. The 30 urn-high back-plate anchor is patterned by deep reactive-ion etching (DRIE) and covered with a thick back-plate of 2.3 μm; thus, it can play an important role in protecting the foundations under the diaphragm anchors from other loads. Furthermore, structure-based equivalent circuit modeling for a capacitive-type MEMS acoustic sensor is implemented with a lumped model, which is subsequently divided into three main areas: acoustic, mechanical, and electrical domains. The acoustic sensor had an open-circuit sensitivity of -43.0 dBV/Pa at 1 kHz with a bias of 10.0 V, while the modeled open-circuit sensitivity was -42.7 dBV/Pa, which shows good agreement in the range from 100 Hz to 18 kHz. This demonstrates the validity of the structure-based equivalent circuit model for the prediction and design of the sensor. © 2013 IEEE.
- KSP Keywords
- Acoustic Sensor, Back-plate, Capacitive-type, Equivalent circuit modeling, Inlet type, Lumped model, Micro-electro-mechanical system(MEMS), Reactive ion etching, open-circuit, plate anchor, structure-based