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Journal Article
Fabrication of Well-Controlled Wavy Metal Interconnect Structures on Stress-Free Elastomeric Substrates
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- Authors
- Chan Woo Park, Soon Won Jung, Sang Chul Lim, Ji-Young Oh, Bock Soon Na, Sang Seok Lee, Hye Yong Chu, Jae Bon Koo
- Issue Date
- 2014-01
- Citation
- Microelectronic Engineering, v.113, pp.55-60
- ISSN
- 0167-9317
- Publisher
- Elsevier
- Language
- English
- Type
- Journal Article
- Abstract
- We propose a new technique for fabricating well-controlled wavy surface structures on an elastomeric substrate at a few-micrometer scale without any pre-stretching and deposition steps, as the platform for stretchable metal interconnects. In this process, the wavy structure is defined by photolithography on a stress-free elastomeric substrate, so that we can provide various types of wavy profiles for metal interconnects with arbitrary sizes and orientations within a single substrate. As the wavy structures can be formed only within selected regions while keeping the whole substrate area free of strain, it may be possible to fabricate entire circuitry including active devices directly on the elastomeric substrate with no need for mechanical transfer steps. The present technique can provide a practical strategy for realizing large-area stretchable electronic circuits, for various applications such as stretchable display or wearable electronic systems. © 2013 Elsevier B.V. All rights reserved.
- KSP Keywords
- Active devices, Deposition steps, Electronic circuit, Electronic system, Interconnect structure, Metal interconnects, Micrometer scale, Pre-stretching, Single substrate, Wavy surface, Well-controlled