상세정보
학술지
Fabrication of Well-Controlled Wavy Metal Interconnect Structures on Stress-Free Elastomeric Substrates
- 발행일
- 201401
- 출처
- Microelectronic Engineering, v.113, pp.55-60
- ISSN
- 0167-9317
- 출판사
- Elsevier
- 협약과제
- 13VB1900, 에너지 절감을 위한 7인치기준 2W급 환경적응 디스플레이 신모드 핵심 원천 기술 개발, 추혜용
- 초록
- We propose a new technique for fabricating well-controlled wavy surface structures on an elastomeric substrate at a few-micrometer scale without any pre-stretching and deposition steps, as the platform for stretchable metal interconnects. In this process, the wavy structure is defined by photolithography on a stress-free elastomeric substrate, so that we can provide various types of wavy profiles for metal interconnects with arbitrary sizes and orientations within a single substrate. As the wavy structures can be formed only within selected regions while keeping the whole substrate area free of strain, it may be possible to fabricate entire circuitry including active devices directly on the elastomeric substrate with no need for mechanical transfer steps. The present technique can provide a practical strategy for realizing large-area stretchable electronic circuits, for various applications such as stretchable display or wearable electronic systems. © 2013 Elsevier B.V. All rights reserved.
- KSP 제안 키워드
- Active devices, Deposition steps, Electronic circuit, Electronic systems, Interconnect structures, Metal interconnects, Micrometer scale, Pre-stretching, Single substrate, Wavy surface, Well-controlled