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논문 검색
Type SCI
Year ~ Keyword

Detail

Conference Paper Development of the Backside Via Holes Process for SiC Power Device
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Authors
고상춘, 성호근, 민병규, 박영락, 장우영, 김정진, 안호균, 장우진, 문재경, 남은수
Issue Date
2013-02
Citation
한국 반도체 학술 대회 (KCS) 2013, pp.1-2
Language
Korean
Type
Conference Paper
KSP Keywords
SiC power devices, Via-hole