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Conference Paper Flexible Nonstick Replica Mould for Transfer Printing of Ag Ink
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Authors
Bong Kuk Lee, Young Jun Kim, Won Ick Jang, Lee-Mi Do, Jaehoon Park
Issue Date
2013-09
Citation
International Conference on Flexible and Printed Electronics (ICFPE) 2013, pp.1-1
Language
English
Type
Conference Paper
KSP Keywords
Ag ink, transfer printing
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