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Journal Article Preliminary Works of Contact via Formation of LCD Backplanes Using Silver Printing
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Authors
Yong Suk Yang, In-Kyu You, 한현, Koo Jae Bon, Lim Sang Chul, Soon-Won Jung, Na Bock Soon, Kim Hye Min, 김민석, Moon Seok-Hwan
Issue Date
201308
Source
ETRI Journal, v.35 no.4, pp.571-577
ISSN
1225-6463
Publisher
한국전자통신연구원 (ETRI)
DOI
https://dx.doi.org/10.4218/etrij.13.1912.0018
Abstract
The fabrication of a thin-film transistor backplane and a liquid-crystal display using printing processes can eliminate the need for photolithography and offers the potential to reduce the manufacturing costs. In this study, we prepare contact via structures through a poly(methyl methacrylate) polymer insulator layer using inkjet printing. When droplets of silver ink composed of a polymer solvent are placed onto the polymer insulator and annealed at high temperatures, the silver ink penetrates the interior of the polymer and generates conducting paths between the top and bottom metal lines through the partial dissolution and swelling of the polymer. The electrical property of various contact via-hole interconnections is investigated using a semiconductor characterization system. © 2013 ETRI.
KSP Keywords
High Temperature, Insulator layer, Partial dissolution, Polymer insulator, Thin-Film Transistor(TFT), Via-hole, electrical properties(I-V curve), inkjet printing, liquid crystal display(LCD), manufacturing cost, methyl methacrylate(Macroporous poly)