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Conference Paper
Novel Interconnection Technology for Flex-on-Glass (FOG) Applications
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- Authors
- Haksun Lee, Yong-Sung Eom, Hyun-Cheol Bae, Kwang-Seong Choi
- Issue Date
- 2013-09
- Citation
- European Microelectronics and Packaging Conference (EMPC) 2013, pp.1-5
- Language
- English
- Type
- Conference Paper
- Abstract
- Interconnections using anisotropic conductive films (ACF) were dominant in applications for flat-panel displays. However, a novel bonding mechanism for flex-on-glass interconnection is presented. Using SBM (Solder Bump Maker) technology, SnAgCu solder bumps were created on a glass substrate with a uniform height. Then, the glass substrate is thermo-compression bonded with a flexible PCB using a multifunctional bonding material called “Fluxing underfill”. The interconnection using solder and underfill method was analyzed through cross-sectional SEM image. Contact resistance values in the order of 10-4 Ω, which is about two times lower than that of the conventional ACFs, were obtained. Preliminary results on cross-section analysis and contact resistance measurement indicate the novel bonding mechanism using the Fluxing underfill has a potential for applications in display interconnections.
- KSP Keywords
- Anisotropic Conductive Films(ACFs), Bonding material, Contact resistance(73.40.Cg), Cross-sectional, Flexible PCB, Glass substrate, Resistance measurement, SEM images, SnAgCu solder, Solder bump, Thermo-compression