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Conference Paper Novel Low-Volume Solder-on-Pad for Fine-Pitch Cu Pillar Bump

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Authors: Hyun-Cheol Bae, Haksun Lee, Yong-Sung Eom, Kwang-Seong Choi

Issue Date: 2013-09

Citation: European Microelectronics and Packaging Conference (EMPC) 2013, pp.1-4

Language: English

Type: Conference Paper

KSP Keywords: Cu pillar bump, fine pitch, low-volume

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