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Conference Paper
Thermally Activated Bumping Process using Sn3.0Ag0.5Cu Solder Powder for Low-Cost Interposers
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- Authors
- Kwang-Seong Choi, Ho-Eun Bae, Haksun Lee, Hyun-Cheol Bae, Yong-Sung Eom
- Issue Date
- 2013-09
- Citation
- International Symposium on Microelectronics (IMAPS) 2013, pp.420-423
- Language
- English
- Type
- Conference Paper
- Abstract
- A novel bumping process using solder bump maker (SBM) is developed for fine-pitch flip chip bonding. It features maskless screen printing process with the result that a fine-pitch, low-cost, and lead-free solder-on-pad (SoP) technology can be easily implemented. The process includes two main steps: one is the thermally activated aggregation of solder powder on the metal pads on a substrate and the other is the reflow of the deposited powder on the pads. Only a small quantity of solder powder adjacent to the pads can join the first step, so a quite uniform SoP array on the substrate can be easily obtained regardless of the pad configurations. Through this process, an SoP array on an organic substrate with a pitch of 130 μm is, successfully, formed.
- KSP Keywords
- Flip-chip(FC), Flip-chip bonding, Low-cost, Organic substrate, Screen printing process, Solder bump, fine pitch, lead-free solder, thermally activated