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Conference Paper
Sol-gel based metal interconnector improved by carbon nanotubes (CNTs) in through silicon via (TSV) structure
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- Authors
- B.M. Sung, Roza Aseffa Lemelemu, D.G. Jung, W.I. Jang, S.H. Kong
- Issue Date
- 2014-11
- Citation
- International Microprocesses and Nanotechnology Conference (MNC) 2014, pp.1-2
- Language
- English
- Type
- Conference Paper
- KSP Keywords
- Carbon nano-tube(CNT), Sol-Gel, Through silicon vias(TSV)