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Journal Article Optical Chip-to-Chip Link System by Using Optical Wiring Method for Reducing EMI
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Authors
In-Kui Cho, Jae-Hoon Yun, Myung-Yung Jeong, Hyo-Hoon Park
Issue Date
2010-08
Citation
IEEE Transactions on Advanced Packaging, v.33, no.3, pp.722-728
ISSN
1521-3323
Publisher
IEEE
Language
English
Type
Journal Article
DOI
https://dx.doi.org/10.1109/TADVP.2010.2049018
Project Code
10MR4900, Development of RF energy Transmission under 100 Watts and Harvesting Technology, Yun Je Hoon
Abstract
This paper describes a new optical link system which consists of a metal optical bench, a module printed circuit board, a driver/receiver integrated circuit, a vertical-cavity surface-emitting laser/photo diode (VCSEL/PD) array, and an optical link block with plastic optical fibers for reducing electromagnetic interference (EMI) noise. For the optical interconnection between the light-sources and detectors, an optical wiring method whose distinctive features include the absence of EMI noise and easy assembly is proposed. The results clearly demonstrate that the use of an optical wiring method can provide robust, cost-effective assembly and easy-repair. We successfully achieved a 4.5 Gb/s data transmission rate without EMI problems. © 2006 IEEE.
KSP Keywords
Data transmission rate, Distinctive features, EMI noise, Electromagnetic interference, Integrated circuit, Optical interconnection, Photo diode, Wiring method, chip-to-chip, cost-effective, optical link