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학술대회 Development of a Heat Pipe Heat Dissipation Method for CPV Application
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저자
문석환, 이규호, 홍수현, 고상춘, 전치훈, 문재경, 박기성, 박준희
발행일
201404
출처
International Conference on Concentrator Photovoltaic Systems (CPV) 2014, pp.140-143
DOI
https://dx.doi.org/10.1063/1.4897047
협약과제
13VB6500, 도광판 구조를 갖는 고집광 태양광 모듈 제작 기술 개발, 문석환
초록
Even when there is a sufficient heat dissipation area from the heat sink to the environment, if the heat flux in the chip package substrate cannot be transferred rapidly to the heat sink, a thermal problem may occur.[1] In this study, a relatively thin CPV module compared to general models was considered. Because four solar chips are mounted on a center column in the CPV module, heat can accumulate rapidly. Therefore, a heat pipe with high thermal conductivity was considered as the heat dissipation method.[2] The heat pipe adopted in the present study is commercially available and has a circular type sintered wick in it. To apply the heat pipe to the CPV module with thin thickness and a central column with 4 solar cells, it should be pressed and bent. The thermal characteristics of the pressed and bent heat pipe was investigated experimentally.
키워드
Bending, Cooling, Heat transfer, High heat flux, Phase change heat transfer, Pressing
KSP 제안 키워드
Dissipation method, Heat Dissipation, Heat sink, Package substrate, Phase change heat transfer, Sintered wick, Solar Cells, Thermal characteristic, chip package, heat pipe, high heat flux