상세정보
학술대회
Development of a Heat Pipe Heat Dissipation Method for CPV Application
- 발행일
- 201404
- 출처
- International Conference on Concentrator Photovoltaic Systems (CPV) 2014, pp.140-143
- 협약과제
- 13VB6500, 도광판 구조를 갖는 고집광 태양광 모듈 제작 기술 개발, 문석환
- 초록
- Even when there is a sufficient heat dissipation area from the heat sink to the environment, if the heat flux in the chip package substrate cannot be transferred rapidly to the heat sink, a thermal problem may occur.[1] In this study, a relatively thin CPV module compared to general models was considered. Because four solar chips are mounted on a center column in the CPV module, heat can accumulate rapidly. Therefore, a heat pipe with high thermal conductivity was considered as the heat dissipation method.[2] The heat pipe adopted in the present study is commercially available and has a circular type sintered wick in it. To apply the heat pipe to the CPV module with thin thickness and a central column with 4 solar cells, it should be pressed and bent. The thermal characteristics of the pressed and bent heat pipe was investigated experimentally.
- KSP 제안 키워드
- Dissipation method, Heat Dissipation, Heat flux, Heat sink, Package substrate, Sintered wick, Solar Cells, Thermal Characteristics, chip package, heat pipe, high thermal conductivity