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Conference Paper
Development of a Heat Pipe Heat Dissipation Method for CPV Application
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- Authors
- Seok-Hwan Moon, Kyu-Ho Lee, Soo-Hyun Hong, Sang-Choon Ko, Chi-Hoon Jun, Jae-Kyoung Mun, Ki-Sung Park, Jun-Hee Park
- Issue Date
- 2014-04
- Citation
- International Conference on Concentrator Photovoltaic Systems (CPV) 2014, pp.140-143
- Language
- English
- Type
- Conference Paper
- Abstract
- Even when there is a sufficient heat dissipation area from the heat sink to the environment, if the heat flux in the chip package substrate cannot be transferred rapidly to the heat sink, a thermal problem may occur.[1] In this study, a relatively thin CPV module compared to general models was considered. Because four solar chips are mounted on a center column in the CPV module, heat can accumulate rapidly. Therefore, a heat pipe with high thermal conductivity was considered as the heat dissipation method.[2] The heat pipe adopted in the present study is commercially available and has a circular type sintered wick in it. To apply the heat pipe to the CPV module with thin thickness and a central column with 4 solar cells, it should be pressed and bent. The thermal characteristics of the pressed and bent heat pipe was investigated experimentally.
- KSP Keywords
- Dissipation method, Heat Sink, Heat dissipation, Heat pipe, Package substrate, Sintered wick, Solar Cells, Thermal Characteristics, chip package, heat flux, high thermal conductivity