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Conference Paper The Effect of Back-Chamber Volume on the Surface Micromachined Acoustic Sensor
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Authors
Chang Han Je, Jaewoo Lee, Sung Q Lee, Woo Seok Yang
Issue Date
2014-11
Citation
SENSORS 2014, pp.1-4
Language
English
Type
Conference Paper
DOI
https://dx.doi.org/10.1109/ICSENS.2014.6985220
Abstract
We present a study of the back-chamber volume effects on sensitivity and frequency response of the surface micromachined MEMS acoustic sensor. A surface micromachined acoustic sensor, unlike conventional bulk micromachined sensor, has a limited volume of back-chamber formed under the surface of the substrate. An acoustic back-chambers are formed by isotropic etching of the silicon substrate under sensing structures. However, due to structural limitation and process, it is difficult to fabricate sufficient depth. Consequently, the volume of the backchamber, which is extremely smaller compared to the bulk micromachined acoustic sensor, affects acoustic sensor performance. We fabricated three surface micromachined acoustic sensors which have different membrane diameters, and measured the membrane displacement characteristics while increasing the volume of the back-chamber by controlling the XeF2 etching cycle. As a result, the back-chamber volume of surface micromachined acoustic sensor should not be less than a certain size in order to obtain the desired performance and it depends on the structural parameters such as membrane size and sensing gap.
KSP Keywords
Acoustic Sensor, Displacement characteristics, Frequency response, It depends, Micromachined sensor, Sensor Performance, Silicon substrate, Surface micromachined MEMS, Volume effects, isotropic etching, membrane displacement