Microwave low-noise performance AlGaN/GaN HEMT on a SiC substrate with a wide head double-deck T-shaped gate has been reported. The HEMTs with gatelength (Lg) of 0.17 μm and source-drain spacing (Lsd) of 3.5 μm exhibited a maximum extrinsic transconductance of 360 mS/mm, a current gain cutoff frequency (fT) of 50 GHz, a maximum oscillation frequency ( fmax) of 149 GHz, and three-Terminal breakdown voltage of 113 V. The device exhibited a minimum noise figure (NFmin) of 0.50 and 0.84 dB at 10 and 18 GHz, respectively, when biased at Vds = 5 V and Ids = 140 mA/mm, which is the lowest noise characteristics ever reported for the GaN-based T-shaped gate HEMTs with gate length larger than 0.1 μm. This excellent noise performance is attributed to the reduction of the gate resistance resulting from a wide head T-shaped gate and the improved device characteristics.
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J. Kim et. al, "Trends in Lightweight Kernel for Many core Based High-Performance Computing", Electronics and Telecommunications Trends. Vol. 32, No. 4, 2017, KOGL Type 4: Source Indication + Commercial Use Prohibition + Change Prohibition
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