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Journal Article
Effect of Fluoride-based Plasma Treatment on the Performance of AlGaN/GaN MISFET
- Authors
- Ho-Kyun Ahn, Hae-Cheon Kim, Dong-Min Kang, Sung-Il Kim, Jong-Min Lee, Sang-Heung Lee, Byoung-Gue Min, Hyoung-Sup Yoon, Dong-Young Kim, Jong-Won Lim, Yong-Hwan Kwon, Eun-Soo Nam, Hyoung-Moo Park, Jung-Hee Lee
- Issue Date
- 2016-08
- Citation
- ETRI Journal, v.38, no.4, pp.675-684
- ISSN
- 1225-6463
- Publisher
- 한국전자통신연구원 (ETRI)
- Language
- English
- Type
- Journal Article
- Abstract
- This paper demonstrates the effect of fluoride-based plasma treatment on the performance of Al2O3/AlGaN/GaN metal-insulator-semiconductor heterostructure field effect transistors (MISHFETs) with a T-shaped gate length of 0.20 μm. For the fabrication of the MISHFET, an Al2O3 layer as a gate dielectric was deposited using atomic layer deposition, which greatly decreases the gate leakage current, followed by the deposition of the silicon nitride layer. The silicon nitride layer on the gate foot region was then selectively removed through a reactive ion etching technique using CF4 plasma. The etching process was continued for a longer period of time even after the complete removal of the silicon nitride layer to expose the Al2O3 gate dielectric layer to the plasma environment. The thickness of the Al2O3 gate dielectric layer was slowly reduced during the plasma exposure. Through this plasma treatment, the device exhibited a threshold voltage shift of 3.1 V in the positive direction, an increase of 50 mS/mm in trans conductance, a degraded off-state performance and a larger gate leakage current compared with that of the reference device without a plasma treatment.
- KSP Keywords
- Atomic Layer Deposition, Etching process, Etching technique, Field Effect Transistor(FET), Fluoride-based plasma treatment, Gate Foot, Heterostructure field effect transistors, Metal-insulator-semiconductor(MIS), Nitride layer, Reactive ion etching, Reference device