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Thermoelectric Cooler Module with Enhanced Cooling Ability Using a Hybrid Cu Paste and a Si Substrate
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- Issue Date
- 2016-12
- Citation
- Journal of Nanoscience and Nanotechnology, v.16, no.12, pp.12732-12736
- ISSN
- 1533-4880
- Publisher
- American Scientific Publishers (ASP)
- Language
- English
- Type
- Journal Article
- Abstract
- A cost-effective and cooling-enhanced thermoelectric cooler (TEC) module is proposed using a new die attachment material and a Si substrate. Although silver paste has been widely used in TEC modules, it has generally shown poor shear strength relative to the high material cost and high temperature of the sintering process. A cost-effective hybrid copper paste (HCP) material, which is composed of Ag-coated Cu flakes, solder powder, and a fluxing resin, is proposed to compensate for the weakness of silver paste. By optimizing the volumetric ratio of the Ag-coated Cu flakes, solder powder, and fluxing resin, screen printing and a curing process for the die attachment were successfully developed. A commercial Ag paste and HCP were applied to interconnect p-type and n-type TE legs with the substrate. Two types of TEC modules were fabricated using a ceramic substrate and a Si substrate. TEC with a module size of 40 mm x 40 mm were fabricated with 128 pairs of p- and n-type TE legs. In this work, the DC resistance and cooling capacity of the TEC module using HCP and a Si substrate were measured and compared with a conventional TEC module. The proposed TEC module is proved to work well with its three advantages: cost reduction, process simplification, and cooling ability.
- KSP Keywords
- Ag paste, Ag-coated Cu, Ceramic Substrate, Cooling ability, Cooling capacity, Cu paste, DC Resistance, Enhanced cooling, High Temperature, Material cost, P-type and N-type