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Detail
Journal Article
Novel Maskless Bumping for 3D Integration
- Authors
- Kwang-Seong Choi, Ki-Jun Sung, Byeong-Ok Lim, Hyun-Cheol Bae, Sunghae Jung, Jong-Tae Moon, Yong-Sung Eom
- Issue Date
- 2010-04
- Citation
- ETRI Journal, v.32, no.2, pp.342-344
- ISSN
- 1225-6463
- Publisher
- 한국전자통신연구원 (ETRI)
- Language
- English
- Type
- Journal Article
- Abstract
- A novel, maskless, low-volume bumping material, called solder bump maker, which is composed of a resin and low-melting-point solder powder, has been developed. The resin features no distinct chemical reactions preventing the rheological coalescence of the solder, a deoxidation of the oxide layer on the solder powder for wetting on the pad at the solder melting point, and no major weight loss caused by outgassing. With these characteristics, the solder was successfully wetted onto a metal pad and formed a uniform solder bump array with pitches of 120 μm and 150 μm. Copyright © 2010 ETRI.
- KSP Keywords
- 3D Integration, Low melting, Solder bump, chemical reaction(Biomimetic), low-volume, melting point, oxide layer, weight loss