BROWSE
Detail
Journal Article
Curing Kinetics and Chemorheological Behavior of No-flow Underfill for Sn/In/Bi Solder in Flexible Packaging Applications
- Authors
- Eom Yong-Sung, Son Ji-Hye, Bae Hyun-Cheol, Choi Kwang-Seong, Lee Jin-Ho
- Issue Date
- 2016-12
- Citation
- ETRI Journal, v.38, no.6, pp.1179-1189
- ISSN
- 1225-6463
- Publisher
- 한국전자통신연구원 (ETRI)
- Language
- English
- Type
- Journal Article
- Abstract
- A chemorheological analysis of a no-flow underfill was conducted using curing kinetics through isothermal and dynamic differential scanning calorimetry, viscosity measurement, and solder (Sn/27In/54Bi, melting temperature of 86 °C) wetting observations. The analysis used an epoxy system with an anhydride curing agent and carboxyl fluxing capability to remove oxide on the surface of a metal filler. A curing kinetic of the no-flow underfill with a processing temperature of 130 °C was successfully completed using phenomenological models such as autocatalytic and nth-order models. Temperaturedependent kinetic parameters were identified within a temperature range of 125 °C to 135 °C. The phenomenon of solder wetting was visually observed using an optical microscope, and the conversion and viscosity at the moment of solder wetting were quantitatively investigated. It is expected that the curing kinetics and rheological property of a no-flow underfill can be adopted in arbitrary processing applications.
- KSP Keywords
- Differential scanning calorimetry(photo-DSC), Epoxy system, Flexible packaging, Melting temperature(Tm), Metal filler, No-flow underfill, Optical microscope, Phenomenological models, Processing temperature, Rheological property, Scanning calorimetry(DSC)