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압출 형 박판 히트 파이프의 모세관력 향상을 위한 구조 개발
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- Authors
- 문석환, 박윤우
- Issue Date
- 2016-11
- Citation
- 대한기계학회논문집 B, v.40, no.11, pp.755-759
- ISSN
- 1226-4881
- Publisher
- 대한기계학회(KSME)
- Language
- Korean
- Type
- Journal Article
- Abstract
- The use of heat pipes in the electronic telecommunication field is increasing. Among the various types of heat pipes, the thin flat heat pipe has relatively high applicability compared with the circular heat pipe in the electronic packaging application. The thin flat heat pipe based on extrusion fabrication has a simple capillary wick structure consisting of rectangular cross sectional grooves on the inner wall of the pipe. Although the groove serves as a simple capillary wick, and many such grooves are provided on the inner wall, it is difficult for the grooves to realize a sufficiently high capillary force. In the present study, a thin flat heat pipe with a wire bundle was developed to overcome the drawback of poor capillary force in the thin flat heat pipe with grooves, and was evaluated by conducting tests. In the performance test, the thin flat heat pipe with the wire bundle showed a lower thermal resistance of approximately 3.4 times, and a higher heat transfer rate of approximately 3.8 times with respect to the thin flat heat pipe with grooves as the capillary wick respectively . The possibility of using the wire bundle as a capillary wick in the heat pipe was validated in the present study; further study for commercializing this concept will be taken up in the future.
- KSP Keywords
- Capillary wick, Electronic Packaging, Heat transfer rate, Inner wall, Performance Test, Thin flat, Wick structure, capillary force, flat heat pipe, thermal resistance