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Journal Article
Flexible Nonstick Replica Mold for Transfer Printing of Ag Ink
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- Authors
- Bong Kuk Lee, Han Young Yu, Yarkyeon Kim, Yong Sun Yoon, Won Ik Jang, Lee-Mi Do, Ji-Ho Park, Jaehoon Park
- Issue Date
- 2016-03
- Citation
- Journal of Nanoscience and Nanotechnology, v.16, no.3, pp.2682-2686
- ISSN
- 1533-4880
- Publisher
- American Scientific Publishers (ASP)
- Language
- English
- Type
- Journal Article
- Abstract
- We report the fabrication of flexible replica molds for transfer printing of Ag ink on a rigid glass substrate. As mold precursors, acrylic mixtures were prepared from silsesquioxane-based materials, silicone acrylate, poly(propylene glycol) diacrylate, 3,3,4,4,5,5,6,6,7,7,8,8, 9,9,10,10,10-heptadecafluorodecyl methacrylate, and photoinitiator. By using these materials, the replica molds were fabricated from a silicon master onto a flexible substrate by means of UV-assisted molding process at room temperature. The wettability of Ag ink decreased with increase in the water contact angle of replica molds. On the other hand, the transfer rate of Ag ink onto adhesive-modified substrates increased with increase in the water contact angle of replica molds. Transferred patterns were found to be thermally stable on the photocurable adhesive layer, whereas Ag-ink patterns transferred on non-photocurable adhesives were distorted by thermal treatment. We believe that these characteristics of replica molds and adhesives offer a new strategy for the development of the transfer printing of solution-based ink materials.
- KSP Keywords
- Adhesive layer, Ag ink, Contact angle(CA), Glass substrate, Molding process, New strategy, Poly(propylene glycol) diacrylate, Replica mold, Room temperature, Thermal treatments, Thermally stable