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Journal Article
Chemo-Rheological Characteristics of a Self-Assembling Anisotropic Conductive Adhesive System Containing a Low-Melting Point Solder
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- Authors
- Ji-Won Baek, Keon-Soo Jang, Yong-Sung Eom, Jong-Tae Moon, Jong-Min Kim, Jae-Do Nam
- Issue Date
- 2010-10
- Citation
- Microelectronic Engineering, v.87, no.10, pp.1968-1972
- ISSN
- 0167-9317
- Publisher
- Elsevier
- Language
- English
- Type
- Journal Article
- Abstract
- To achieve the excellent wettability of a solder in an anisotropic conductive adhesive (ACA) in micro-packaging technology, not only the removal of the oxidized layer of the solder but also the chemo-rheological phenomena of the thermally induced self assembly of low-melting temperature solder powders were investigated for ACA applications. Both the optimum kind and amount of reductant were determined in this study to remove the oxidized layer formed on the solder surface in ambient environment. The solder wetting test was performed to observe the chemical and rheological compatibility between the solder, polymer matrix, and reductant. The thermal analysis was done using differential scanning calorimetry (DSC) analysis and rheometer test. Several chemical reactions by the reductant were proposed, and the mechanisms were postulated. It is believed that the reductant reacts with the oxidized layer, amine, and epoxide group, respectively. The relation between conversion and glass transition temperature of the polymer matrix was also obtained from DSC. © 2009 Elsevier B.V. All rights reserved.
- KSP Keywords
- Differential scanning calorimetry(photo-DSC), Differential scanning calorimetry (dsc), Low melting, Melting temperature(Tm), Oxidized layer, Packaging technology, Rheological phenomena, Thermal Analysis, Thermally induced, adhesive system, ambient environment