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Conference Paper
Low Cost Process for Integrated Substrates of Flexible OLEDs using Printing and Plating
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- Authors
- Doo-Hee Cho, O Eun Kwon, Young-Sam Park, Byoung-Gon Yu, Jonghee Lee, Jaehyun Moon, Hyunsu Cho, Hyunkoo Lee, Nam-Sung Cho
- Issue Date
- 2016-12
- Citation
- International Display Workshops in conjunction with Asia Display (IDW/AD) 2016, pp.782-783
- Language
- English
- Type
- Conference Paper
- Abstract
- We have developed a cost-effective process for a flexible integrated substrate of OLEDs with a screen printing, an electroless copper plating, and a deboding process. A photolithographic method and expensive materials such as colorless polyimide and silver paste were not used. The OLED devices with the flexible integrated substrates were successfully fabricated. This process can be applicable to flexible AMOLED displays and OLED lighting panels.
- KSP Keywords
- Colorless polyimide, Electroless copper(EC), Electroless copper plating, Integrated substrate, Low-cost, OLED devices, OLED lighting, Silver Paste, cost-effective, flexible OLED, screen printing