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Journal Article
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- Authors
- 문종태, 엄용성, 이종현
- Issue Date
- 2015-06
- Citation
- 대한용접·접합학회지, v.33, no.3, pp.32-39
- ISSN
- 1225-6153
- Publisher
- 대한용접·접합학회
- Language
- Korean
- Type
- Journal Article
- Abstract
- With the simplicity of process and high reliability in chip or package bonding, epoxy solder paste (ESP)has been recently considered as a competitive bonding material. The ESP material is composed of solderpowder and epoxy formulation which can remove oxide layers on the surface of solder powder and padfinish metal. The bonding formed using ESP shows outstanding bonding strength and suppresses electricalshort between adjacent pads or leads owing to the reinforced structure by cured epoxy after the bonding. ESP is also expected to suppress the formation and growth of whisker on the pads or leads. With thementioned advantages, ESP is anticipated to become a spotlighted bonding material in the assembly offlexible electronics and electronic modules in automotive vehicles.
- KSP Keywords
- Bonding material, Epoxy solder, Formation and growth, High Reliability, Reinforced structure, Solder paste, bonding strength, electronic modules, oxide layer