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Journal Article
Siliconized Silsesquioxane-Based Nonstick Molds for Ultrahigh-Resolution Lithography
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- Authors
- Bong Kuk Lee, Kun-Sik Park, Dong-Pyo Kim, Jin-Hwa Ryu, Jaehoon Park, Ye-Sul Jeong, Kyu-Ha Baek, Lee-Mi Do
- Issue Date
- 2012-08
- Citation
- Journal of Materials Chemistry, v.22, no.33, pp.16754-16760
- ISSN
- 0959-9428
- Publisher
- Royal Society of Chemistry (RSC)
- Language
- English
- Type
- Journal Article
- Abstract
- A material approach to fabricating high-performance nonstick molds for manufacturing ultrahigh-resolution features (<8 nm) is presented. Low-viscosity liquid blends (4-121 cP) consisting of siliconized silsesquioxane acrylate (Si-SSQA) with low surface energy and difunctional acrylics were used as nonstick replica-mold materials. The cured Si-SSQA-acrylic networks showed a high UV transparency (>92% at 365 nm), high modulus and wide-range modulus tunability (0.757-4.192 GPa), high resistance to organic solvents (<1.2 wt%), low shrinkage (<3%), and high water contact angle (91-103째). The Si-SSQA-acrylic blends with a nonstick property were easily transferred to high-resolution replica molds with sub-25 nm features, a pitch of 25 nm and a height of 100 nm, even if the release agent was not modified onto the master. In addition, nonstick replica molds with a low concentration of uncross-linked (meth)acrylate showed the ability to duplicate ultrasmall nanostructures with a sub-8 nm parallel line, a pitch of 17 nm and a height of 6-7 nm. Furthermore, the Si-SSQA-based replica mold prevented the formation of bubble defects during imprinting owing to sufficient gas permeability. © The Royal Society of Chemistry 2012.
- KSP Keywords
- 65 nm, Bubble defects, Contact angle(CA), High performance, High resolution, High water, Low shrinkage, Low surface energy, Parallel lines, Replica mold, UV transparency