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Journal Article
Formation of Metal and Dielectric Liners Using a Solution Process for Deep Trench Capacitors
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- Authors
- Yong-Hyun Ham, Dong-Pyo kim, Kyu-Ha Baek, Kun-Sik Park, Moonkeun Kim, Kwang-Ho Kwon, Hong-Sik Shin, Kijun Lee, Lee-Mi Do
- Issue Date
- 2012-01
- Citation
- Journal of Nanoscience and Nanotechnology, v.12, no.7, pp.5897-5901
- ISSN
- 1533-4880
- Publisher
- American Scientific Publishers (ASP),
- Language
- English
- Type
- Journal Article
- Abstract
- We demonstrated the feasibility of metal and dielectric liners using a solution process for deep trench capacitor application. The deep Si trench via with size of 10.3 μm and depth of 71 μm were fabricated by Bosch process in deep reactive ion etch (DRIE) system. The aspect ratio was about 7. Then, nano-Ag ink and poly(4-vinylphenol) (PVPh) were used to form metal and dielectric liners, respectively. The thicknesses of the Ag and PVPh liners were about 144 and 830 nm, respectively. When the curing temperature of Ag ?lm increased from 120 to 150 °C, the sheet resistance decreased rapidly from 2.47 to 0.72 ??/sq and then slightly decreased to 0.6 ??/sq with further increasing the curing temperature beyond 150 °C. The proposed liner formation method using solution process is a simple and cost effective process for the high capacity of deep trench capacitor. © 2012 American Scientific Publishers.
- KSP Keywords
- 4-vinylphenol(Poly), Ag ink, Bosch process, Curing temperature, Deep reactive ion etch, High capacity, aspect ratio, cost-effective, deep trench capacitor, nano-Ag, sheet resistance