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Conference Paper
Fabrication of GaN HEMT on SiC with Taper-Shaped Backside Via-Hole
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- Authors
- Byoung-Gue MIN, Hyung Sup YOON, Haecheon KIM, Ho-Kyun AHN, Seong-Il KIM, Jong-Min LEE, Byoung-Chul JUN, Youn-Kook JUNG, Jong-Won LIM
- Issue Date
- 2014-12
- Citation
- International Symposium Physics of Semiconductors and Applications (ISPSA) 2014, pp.80-80
- Language
- English
- Type
- Conference Paper
- KSP Keywords
- GaN HEMT, Via-hole