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Conference Paper Multilevel Interconnection Technology using New Pillar Formation Method and CMP Planarization
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Authors
Min Park, Gi Hong Kim, Jong Moon Park, Sang Gi Kim, Yeong Cheol Hyeon, Jin Gun Koo, Kee Soo Nam
Issue Date
1996-02
Citation
International Chemical-Mechanical Polish for VLSI/ULSI Multilevel Interconnection Conference (CMP-MIC) 1996, pp.291-298
Language
English
Type
Conference Paper
KSP Keywords
Multilevel interconnection
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