BROWSE
Detail
Journal Article
Novel Low-Volume Solder-on-Pad Process for Fine Pitch Cu Pillar Bump Interconnection
Cited - time in 
Share 
Share
- Authors
- Hyun-Cheol Bae, Haksun Lee, Yong-Sung Eom, Kwang-Seong Choi
- Issue Date
- 2015-06
- Citation
- 한국마이크로전자 및 패키징학회지, v.22, no.2, pp.55-59
- ISSN
- 1226-9360
- Publisher
- 한국마이크로전자 및 패키징학회지
- Language
- English
- Type
- Journal Article
- KSP Keywords
- Cu pillar bump, fine pitch, low-volume