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학술지 Single Package Directly Modulated Laser Bidirectional Optical Subassembly Using a Modified Mini-dual-in-line Package for 10 Gbps Passive Optical Networks
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저자
이종진, 김종덕, 이세형
발행일
201212
출처
Optical Engineering, v.51 no.12, pp.1-3
ISSN
0091-3286
출판사
SPIE
DOI
https://dx.doi.org/10.1117/1.OE.51.12.120501
협약과제
12ZH1100, 산업계 기술지원사업, 김영선
초록
A bidirectional optical subassembly comprised of a 2.5 Gbps distributed feedback (DFB) laser diode (LD) directly modulated laser transmitter and a 10 Gbps positive intrinsic negative photodiode receiver was developed for an optical network unit of a 10 Gbps passive optical network. Here, a low-cost mini-dual-in-line package was modified to contain whole components of a transmitter and receiver in a single space while satisfying the requirements of 10 Gbps microdevice package standards. The transmitter was fabricated to achieve high optical output power by placing a micro aspheric lens very close to the DFB LD and reducing the thermal resistance between an LD chip and heat sink to bring down the DFB LD chip temperature. As a result, the transmitter output power was 3.5 dB higher than a conventional transistor outline can BOSA due to a high optical coupling efficiency of more than 70% and a low thermal resistance for heat dissipation. The receiver sensitivity was -21 dBm at a bit error rate of 10-3 and the sensitivity penalty of the receiver due to signal crosstalk was less than 0.3 dB. © 2012 Society of Photo-Optical Instrumentation Engineers (SPIE).
키워드
Bidirectional optical subassembly, Direct modulation, Optical network unit, Passive optical network
KSP 제안 키워드
Aspheric lens, Bidirectional optical subassembly(BOSA), Bit Error Rate(And BER), Chip temperature, Direct modulation, Directly modulated laser(DML), Distributed feedback (DFB) laser, Heat Dissipation, Heat sink, In-line, Laser diode(LD)