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Single package directly modulated laser bidirectional optical subassembly using a modified mini-dual-in-line package for 10 Gbps passive optical networks
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- Authors
- Jong Jin Lee, Jongdeog Kim, Seihyoung Lee
- Issue Date
- 2012-12
- Citation
- Optical Engineering, v.51, no.12, pp.1-3
- ISSN
- 0091-3286
- Publisher
- SPIE
- Language
- English
- Type
- Journal Article
- Abstract
- A bidirectional optical subassembly comprised of a 2.5 Gbps distributed feedback (DFB) laser diode (LD) directly modulated laser transmitter and a 10 Gbps positive intrinsic negative photodiode receiver was developed for an optical network unit of a 10 Gbps passive optical network. Here, a low-cost mini-dual-in-line package was modified to contain whole components of a transmitter and receiver in a single space while satisfying the requirements of 10 Gbps microdevice package standards. The transmitter was fabricated to achieve high optical output power by placing a micro aspheric lens very close to the DFB LD and reducing the thermal resistance between an LD chip and heat sink to bring down the DFB LD chip temperature. As a result, the transmitter output power was 3.5 dB higher than a conventional transistor outline can BOSA due to a high optical coupling efficiency of more than 70% and a low thermal resistance for heat dissipation. The receiver sensitivity was -21 dBm at a bit error rate of 10-3 and the sensitivity penalty of the receiver due to signal crosstalk was less than 0.3 dB. © 2012 Society of Photo-Optical Instrumentation Engineers (SPIE).
- KSP Keywords
- Aspheric lens, Bidirectional optical subassembly(BOSA), Bit Error rate, Chip temperature, Directly modulated laser(DML), Distributed feedback (DFB) laser, Heat Sink, Heat dissipation, In-line, Laser diode, Low-cost