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Conference Paper Maskless Screen Printing Technology using Solder Bump Maker (SBM) for Flexible Electronics
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Authors
Kwang-Seong Choi, Haksun Lee, Hyun-Cheol Bae, Yong-Sung Eom, Jin Ho Lee
Issue Date
2015-04
Citation
International Conference on Electronics Packaging & iMAPS All Asia Conference (ICEP & IAAC) 2015, pp.276-291
Language
English
Type
Conference Paper
KSP Keywords
Flexible electronics, Printing technology, Solder bump, screen printing