상세정보
학술지
Improvement of Modulation Bandwidth in Electroabsorption-Modulated Laser by Utilizing the Resonance Property in Bonding Wire
- 발행일
- 201205
- 출처
- Optics Express, v.20 no.11, pp.11806-11812
- ISSN
- 1094-4087
- 출판사
- Optical Society of America (OSA),
- 협약과제
- 11MB2400, 100G 이더넷용 광송수신기 개발, 백용순
- 초록
- We present and demonstrate a simple and cost-effective technique for improving the modulation bandwidth of electroabsorption-modulated laser (EML). This technique utilizes the RF resonance caused by the EML chip (i.e., junction capacitance) and bonding wire (i.e, wire inductance). We analyze the effects of the lengths of the bonding wires on the frequency responses of EML by using an equivalent circuit model. To verify this analysis, we package a lumped EML chip on the sub-mount and measure its frequency responses. The results show that, by using the proposed technique, we can increase the modulation bandwidth of EML from ~16 GHz to ~28 GHz. © 2012 Optical Society of America.
- KSP 제안 키워드
- 28 GHz, 6 GHz, Bonding wires, Frequency response(FreRes), Modulated laser, Modulation bandwidth, cost-effective, equivalent circuit model(ECM), junction capacitance