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Journal Article
Single-Chip Photonic Transceiver Based on Bulk-Silicon, as a Chip-Level Photonic I/O Platform for Optical Interconnects
- Authors
- Gyungock Kim, Hyundai Park, Jiho Joo, Ki-Seok Jang, Myung-Joon Kwack, Sanghoon Kim, In Gyoo Kim, Jin Hyuk Oh, Sun Ae Kim, Jaegyu Park, Sanggi Kim
- Issue Date
- 2015-06
- Citation
- Scientific Reports, v.5, pp.1-11
- ISSN
- 2045-2322
- Publisher
- Nature Publishing Group
- Language
- English
- Type
- Journal Article
- Abstract
- When silicon photonic integrated circuits (PICs), defined for transmitting and receiving optical data, are successfully monolithic-integrated into major silicon electronic chips as chip-level optical I/Os (inputs/outputs), it will bring innovative changes in data computing and communications. Here, we propose new photonic integration scheme, a single-chip optical transceiver based on a monolithic-integrated vertical photonic I/O device set including light source on bulk-silicon. This scheme can solve the major issues which impede practical implementation of silicon-based chip-level optical interconnects. We demonstrated a prototype of a single-chip photonic transceiver with monolithic-integrated vertical-illumination type Ge-on-Si photodetectors and VCSELs-on-Si on the same bulk-silicon substrate operating up to 50Gb/s and 20Gb/s, respectively. The prototype realized 20Gb/s low-power chip-level optical interconnects for {\\lambda} ~850nm between fabricated chips. This approach can have a significant impact on practical electronic-photonic integration in high performance computers (HPC), cpu-memory interface, hybrid memory cube, and LAN, SAN, data center and network applications.
- KSP Keywords
- Bulk silicon, Data center, Electronic chips, Ge-on-Si, High performance computers, Hybrid Memory Cube, I/O devices, Illumination type, Integration scheme, Light source, Memory interface
This work is distributed under the term of Creative Commons License (CCL)
(CC BY)
(CC BY)
