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Journal Article Single-Chip Photonic Transceiver Based on Bulk-Silicon, as a Chip-Level Photonic I/O Platform for Optical Interconnects
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Authors
Gyungock Kim, Hyundai Park, Jiho Joo, Ki-Seok Jang, Myung-Joon Kwack, Sanghoon Kim, In Gyoo Kim, Jin Hyuk Oh, Sun Ae Kim, Jaegyu Park, Sanggi Kim
Issue Date
2015-06
Citation
Scientific Reports, v.5, pp.1-11
ISSN
2045-2322
Publisher
Nature Publishing Group
Language
English
Type
Journal Article
DOI
https://dx.doi.org/10.1038/srep11329
Project Code
14MB1300, Silicon Nanophotonics-based next-generation computer interface platform, Kim Gyungock
Abstract
When silicon photonic integrated circuits (PICs), defined for transmitting and receiving optical data, are successfully monolithic-integrated into major silicon electronic chips as chip-level optical I/Os (inputs/outputs), it will bring innovative changes in data computing and communications. Here, we propose new photonic integration scheme, a single-chip optical transceiver based on a monolithic-integrated vertical photonic I/O device set including light source on bulk-silicon. This scheme can solve the major issues which impede practical implementation of silicon-based chip-level optical interconnects. We demonstrated a prototype of a single-chip photonic transceiver with monolithic-integrated vertical-illumination type Ge-on-Si photodetectors and VCSELs-on-Si on the same bulk-silicon substrate operating up to 50Gb/s and 20Gb/s, respectively. The prototype realized 20Gb/s low-power chip-level optical interconnects for {\\lambda} ~850nm between fabricated chips. This approach can have a significant impact on practical electronic-photonic integration in high performance computers (HPC), cpu-memory interface, hybrid memory cube, and LAN, SAN, data center and network applications.
KSP Keywords
Data center, Electronic chips, Ge-on-Si, High-performance computer(HPC), Hybrid Memory Cube, I/O devices, Illumination type, Integration scheme, Light sources, Low-Power, Memory interface
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CC BY