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Journal Article Fabrication of Low-Cost Submicron Patterned Polymeric Replica Mold with High Elastic Modulus over a Large Area
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Authors
Joo Yeon Kim, Kun-Sik Park, Zin-Sig Kim, Kyu-Ha Baek, Lee-Mi Do
Issue Date
2012-01
Citation
Soft Matter, v.8, no.4, pp.1184-1189
ISSN
1744-683X
Publisher
Royal Society of Chemistry (RSC)
Language
English
Type
Journal Article
DOI
https://dx.doi.org/10.1039/c1sm06788e
Abstract
Low cost submicron patterning technique to fabricate a large area polymeric replica mold using an ultraviolet nanoimprint lithography (UV-NIL) technique is reported. A photo-curable polyurethane-acrylate (PUA) precursor was densified via UV light in order to form a solid polymeric replica mold and to maximise its stability, yet stable mechanical properties with different UV-exposure times were studied using a nanoindentation method as a function of the penetration depth during the loading-unloading cycles. The PUA replica mold demonstrated very high mechanical properties of hardness (0.15 GPa) and elastic modulus (2.7 GPa) due to the increased cross-linking density of the PUA precursor at an optimized UV-exposure time of 600 s. The PUA replica mold demonstrated potential for the fabrication of multi-scale line-and-space patterns with sizes of 350 nm or less with good uniformity and reproducibility over large areas. The replication of the polymeric mold with high durability and excellent mechanical properties can be economically valuable to physical contact nanolithography processes for the high throughput fabrication of micro- and nanodevices. © 2012 The Royal Society of Chemistry.
KSP Keywords
Cross-linking density, Exposure time, High durability, High elastic modulus, High mechanical properties, High throughput, Line-and-space, Loading-unloading, Low-cost, Mechanical properties(PMCs), Micro-