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Journal Article Experimental study on the performance of miniature heat pipes with woven-wire wick
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Moon Seok-Hwan, Yun Ho-Gyeong, Hwang Gunn, Tae-Goo Choy
Issue Date
IEEE Transactions on Components and Packaging Technologies, v.24 no.4, pp.591-595
Project Code
01MD1400, Micro Devices Technology for High Heat Flux Packaging, Hwang Gunn
The thermal density of electronic system has been increased continuously because high speed and high density are required for them. The heat dissipation of CPU for a notebook PC has been recently increased to be more than 10 W, but, on the other hand, the available packaging space has been decreased. Therefore, it has become inevitable to perform cooling by using miniature heat pipes (MHPs). In the present study, a new woven-wire-type wick for the MHP is developed, which has a large capillary limit and a high productivity. These MHPs with diameters of 3 mm or 4 mm are applicable to small-sized electronic parts such as CPU of a notebook PC. Because the operational characteristics of MHPs with the diameters of 3 mm or 4 mm are different from those of general medium-size heat pipes, performance tests have been conducted in order to review heat-transfer characteristics and effects of various factors on the performance of MHPs. The design factors under consideration are fill ratio of working fluid, length of heat pipe, length of evaporator and condenser, inclination angle of installation, number of wick strand and thermal load.
KSP Keywords
Capillary limit, Design factors, Electronic systems, Experimental study, Fill ratio, Heat Dissipation, Heat pipes, Heat transfer characteristics, High Speed, High-Productivity, High-density