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Journal Article Interface-Engineered Amorphous TiO2-Based Resistive Memory Devices
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Authors
Hu Young Jeong, Jeong Yong Lee, Sung-Yool Choi
Issue Date
2010-11
Citation
Advanced Functional Materials, v.20, no.22, pp.3912-3917
ISSN
1616-301X
Publisher
John Wiley & Sons
Language
English
Type
Journal Article
DOI
https://dx.doi.org/10.1002/adfm.201001254
Abstract
Crossbar-type bipolar resistive memory devices based on low-temperature amorphous TiO2 (a-TiO2) thin films are very promising devices for flexible nonvolatile memory applications. However, stable bipolar resistive switching from amorphous TiO2 thin films has only been achieved for Al metal electrodes that can have severe problems like electromigration and breakdown in real applications and can be a limiting factor for novel applications like transparent electronics. Here, amorphous TiO 2-based resistive random access memory devices are presented that universally work for any configuration of metal electrodes via engineering the top and bottom interface domains. Both by inserting an ultrathin metal layer in the top interface region and by incorporating a thin blocking layer in the bottom interface, more enhanced resistance switching and superior endurance performance can be realized. Using high-resolution transmission electron microscopy, point energy dispersive spectroscopy, and energy-filtering transmission electron microscopy, it is demonstrated that the stable bipolar resistive switching in metal/a-TiO2/metal RRAM devices is attributed to both interface domains: the top interface domain with mobile oxygen ions and the bottom interface domain for its protection against an electrical breakdown. Engineering of both interface domains in amorphous TiO2-based RRAM devices makes it possible that the devices are operated at any configuration of metal electrodes. By inserting an active thin metal layer at the top interface and embedding an Al2O3 blocking layer at the bottom interface, enhanced memory properties can be obtained compared to the conventional Al/a-TiO2/Al devices. Copyright © 2010 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
KSP Keywords
Amorphous TiO 2, Blocking layer, Co. KGaA, Electrical breakdown, Electron microscopy(SEM), Energy dispersive spectroscopy(EDS), Flexible nonvolatile memory, Interface region, Limiting factor, Memory applications, Memory properties